PCB Assembly — PCBA

Stencil to shipment.
Fast. Certified. Reliable.

Full-cycle SMT, through-hole, and mixed PCB assembly for semiconductor fabs, EMS companies, automotive, and medical device manufacturers worldwide. IPC Class 2 & 3 compliant — with expert engineers on every build.

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25+
Years in industry
No MOQ
Prototype to production
IPC-610
Class 2 & Class 3
Fast
Turnaround & delivery
01 / Assembly Types

Every assembly method under one roof.

From fine-pitch SMT to heavy through-hole and complex mixed builds — we handle the full spectrum of PCB assembly for your production needs.

Surface Mount Technology SMT line in operation
Surface Mount Technology (SMT)
High-speed stencil printing, pick-and-place, and nitrogen reflow for dense, fine-pitch assemblies. Handles passive components down to 01005 and ICs from BGA to QFN with 0.4 mm pitch.
01005 passives 0.4mm BGA QFN / QFP PoP Double-sided
Through-Hole Technology soldering process
Through-Hole Technology (THT)
Selective and wave soldering for connectors, transformers, electrolytic capacitors, and power components requiring the mechanical strength of through-hole mounting.
Wave soldering Selective soldering Press-fit Hand solder
Mixed Assembly board
Mixed Assembly
SMT and THT combined on the same board — optimised sequencing to avoid thermal re-work and protect already-placed components. Full DFM review before first article.
SMT + THT DFM review First article Conformal coat
02 / Technical Capabilities

Assembly specs that matter.

Component handling and board specs our line is qualified to build — covering prototype through production volumes.

Component Capabilities
Smallest passive
01005 (0.4×0.2 mm)
Smallest BGA pitch
0.4 mm
Fine-pitch QFP / QFN
0.2 mm pitch
Max component height
25 mm
Solder alloys
Leaded & Lead-free
Flux type
No-clean / Water-wash
IC programming
Available on request
Board & Process
Board size (max)
600 × 500 mm
Board thickness
0.4 – 6.0 mm
Layer count
1 – 14 layers
Board types
Rigid, Flex, Rigid-flex
Min order qty
No minimum (1 piece)
Turnaround (proto)
3 – 5 business days
Conformal coating
Acrylic, silicone, PU
03 / Assembly Process

10-step build workflow.

From gerber review to ESD-safe delivery — every build follows the same documented, traceable process.

01
DFM Review
Gerbers, BOM, and centroid reviewed for footprint issues, pad violations, and solder mask slivers before any material is committed.
02
IQC & Kitting
Incoming components inspected against BOM spec. Kitted per build job to prevent mix-up. Date codes verified and counterfeit screening applied.
03
Stencil & Paste Print
Laser-cut stainless stencil. RoHS-compliant solder paste applied with automated printer at controlled temperature and humidity.
04
SPI
Solder Paste Inspection measures volume, area, and height of every paste deposit before placement — catching bridging and insufficient paste early.
05
SMT Placement
High-speed pick-and-place with vision alignment. First article verified by engineer before full-run approval is issued.
06
Reflow Soldering
Profiled nitrogen reflow for oxidation-free joints. KIC thermal profiling confirms peak temperature and time-above-liquidus per IPC J-STD.
07
AOI Inspection
Automated Optical Inspection checks component presence, polarity, skew, solder bridging, and tombstoning after reflow with full traceability records.
08
THT & Wave
Through-hole insertion followed by selective or wave soldering. Flux application and topside temperature controlled per IPC-A-610 acceptance criteria.
09
QC & Testing
X-ray for BGA hidden joints, flying-probe or ICT electrical test, and functional test per customer-agreed test plan. Full test records issued.
10
Pack & Deliver
ESD-safe packaging, CoC and test records included. Same-country delivery to your facility — no customs clearance, no delays, no surprises.
04 / Quality Control

Six checkpoints. Zero escapes.

Every build passes through six independent inspection stages — each with documented records you can reference against your IPC audit requirements.

01

IQC — Incoming Quality Control

All components and bare boards inspected on receipt. Date codes, quantity, and package marking verified before kitting. Counterfeit screening available on request.

02

SPI — Solder Paste Inspection

3D solder paste volume, area, and offset measured at every deposit after printing. Boards failing SPI are re-printed — not sent to placement.

03

First Article Inspection

After placement, the first board of every job is manually verified by an engineer before the full run is approved. Component identity, polarity, and position confirmed against BOM.

04

AOI — Automated Optical Inspection

Post-reflow AOI detects missing components, solder bridges, lifted leads, tombstoning, and polarity errors with photographic evidence logged per board.

05

X-Ray — Hidden Joint Inspection

BGA and other hidden-joint packages inspected by X-ray for voiding, cold joints, and bridging not visible to AOI. Sampling rate or 100% inspection per your spec.

06

Final QA & Shipment Inspection

IPC-A-610 visual workmanship check by a certified IPC-CIS. CoC, test records, and traveller documentation packaged with every shipment.

05 / Testing Services

Test coverage for every build class.

From simple AOI to full functional validation — we match test coverage to your product's risk profile and qualification requirements.

AOI Testing
Automated optical inspection on every board post-reflow. Detects placement errors, bridges, and opens with full image archive.
X-Ray Inspection
BGA solder joint analysis — voiding percentage, bridging, and cold joints in hidden packages verified to IPC-7095 criteria.
In-Circuit Test (ICT)
Bed-of-nails fixture tests component values, opens, shorts, and basic function. Ideal for mid-to-high volume production boards.
Flying Probe
Fixtureless electrical test for prototype and low-volume builds. Checks opens, shorts, and component values without a dedicated ICT fixture.
Functional Test (FCT)
Board powered up and exercised through its operating modes using customer-supplied or Antech-developed test jigs and scripts.
IC Programming
Microcontroller and FPGA device programming during assembly. Firmware version controlled and verified post-programming before shipment.
Environmental Stress
Burn-in, thermal cycling, and humidity exposure for accelerated life testing. Supported by our QRA laboratory for full qualification packages.
Conformal Coating
Acrylic, silicone, or polyurethane coating applied to customer spec for protection against humidity, corrosion, and vibration.
06 / Component Sourcing

Kitted or turnkey — your choice.

Bring your own parts or let us source everything. Either way, every component goes through IQC before it touches your board.

Kitted Assembly

You supply the parts

You deliver pre-kitted components matched to your BOM
Antech performs incoming inspection on all supplied parts before assembly
Ideal when you have existing supplier relationships or approved vendor lists
Any shortages or discrepancies flagged before build commences — no surprises mid-run
Consigned and customer-owned inventory managed with barcode tracking
Turnkey Assembly

We source everything

BOM submitted — we quote and procure all components through authorised distribution channels
Date code and authenticity verified; counterfeit screening available for critical ICs
Rare and long-lead parts sourced through our regional supply chain network
Part crosses and approved substitutes offered with customer sign-off before procurement
Single invoice covers components and assembly — simplifies your PO process
07 / Industries

Built for the industries that matter most.

We assemble boards for the most demanding Philippine manufacturers — where IPC Class 3, traceability, and same-country support are non-negotiable.

Semiconductor Fabs
EMS / Electronics
Automotive Electronics
Medical Devices
Industrial Controls
Test & Measurement
08 / Why Antech for PCBA

Expert engineers. No minimums. Fast turnaround.

Three things an offshore assembly house cannot offer — and the three things that matter most when you're running demanding production.

Direct engineers, fast response

Our assembly engineers respond directly. You reach them without queues — no ticket systems, no language barriers, no overnight lag. DFM feedback, first article review, and yield discussions happen in real time.

IPC-certified, reliable delivery

Assemblies built to IPC-A-610 standards and delivered on schedule — streamlined logistics, competitive lead times, and full CoC documentation included on every job.

No MOQ — prototype to production

We assemble single boards for R&D teams the same way we run production lots of thousands. Pricing scales naturally with volume — but you are never turned away for a small prototype order.

09 / FAQ

Common questions answered.

PCB manufacturing produces the bare board — copper traces, drilled holes, and surface finish. PCBA (Printed Circuit Board Assembly) is the process of mounting electronic components onto that bare board using solder — creating a functional circuit. Antech handles both: we can coordinate bare board fabrication and deliver a fully assembled, tested board ready for your product.

There is no minimum order quantity. We regularly assemble single prototype boards for engineering teams and scale to production volumes of thousands of units for EMS customers. Setup costs are quoted transparently — you decide whether a small run makes economic sense for your project.

For a complete quote we need: (1) Gerber files or ODB++ for the bare board, (2) Bill of Materials (BOM) with manufacturer part numbers and approved alternates, and (3) centroid / pick-and-place file for SMT placement. If you are sourcing components yourself (consigned), provide them kitted per BOM. If you need turnkey sourcing, the BOM alone is sufficient to start.

Prototype builds (consigned components, simple boards) typically run in 3–5 business days after DFM approval and parts receipt. Turnkey builds depend on component lead time. Production volumes are scheduled based on complexity and quantity — contact us for a confirmed lead time based on your specific build.

Yes. We support IPC-A-610 Class 2 (general electronics) and Class 3 (high-reliability: medical, automotive, defense) builds. Class 3 jobs receive 100% AOI, X-ray inspection on BGA packages, and full traceability documentation including component lot codes, solder paste batch, and reflow profile records. Conformal coating and potting are available for additional environmental protection.

Start your build

Ready to assemble?

Send us your Gerbers and BOM — we'll come back with a quote, DFM feedback, and a confirmed lead time within one business day.

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