End-to-end PCB design, fabrication, and SMT assembly for semiconductor, EMS, automotive, and medical manufacturers for demanding semiconductor, EMS, automotive, and medical applications worldwide. Multilayer, flex, rigid-flex, and HDI — engineered to specification and delivered on schedule.
From fine-pitch SMT to heavy through-hole and complex mixed builds — we handle the full spectrum of PCB assembly for your production needs.
From simple 2-layer prototypes to complex multilayer and rigid-flex assemblies — we design, fabricate, and assemble every board type used in modern electronics manufacturing.
Every project follows a structured workflow from requirements capture through packaged delivery — with customer visibility at each gate.
Our engineers work from your schematic in Altium Designer, KiCad, or Eagle — producing a routed, DRC-clean layout optimized for your specific layer count, impedance requirements, and assembly process. We perform DFM review before releasing Gerbers, flagging component footprint issues, minimum annular ring violations, and solder mask slivers before they become fabrication problems.
For high-speed designs, we apply signal integrity analysis for differential pairs, length-matched data buses, and power delivery network decoupling — ensuring your board performs in production, not just in the lab.
| Min Track/Space | 3 / 3 mil |
| Min Via Drill | 0.2 mm |
| Max Layer Count | 12+ |
| Board Thickness | 0.4 – 3.2 mm |
| Max Board Size | 500 × 600 mm |
| Surface Finish | HASL, ENIG, OSP |
We manage fabrication through qualified partner facilities with full IPC-6012 Class 2 and Class 3 capability. All substrates undergo incoming material inspection, and completed bare boards receive electrical continuity and isolation testing on flying-probe fixtures before leaving the fab.
For impedance-critical designs, we maintain controlled-impedance coupon testing on every panel, with TDR measurement reports included in the quality pack. Certificates of conformance and UL-marked laminates are available on request.
| Prototype Lead Time | 48 – 72 hr |
| Production Lead Time | 5 – 10 days |
| Copper Weight | 0.5 – 6 oz |
| Aspect Ratio | up to 10:1 |
| Soldermask | LPI, any colour |
| Silkscreen | Both sides |
Surface mount assembly from solder paste printing through reflow, covering 0201 passives, fine-pitch QFP, BGA, LGA, and CSP packages. Our assembly line operates under IPC-A-610 acceptance criteria, with AOI and X-ray inspection available for BGA and hidden-joint verification.
Through-hole components are processed via selective soldering or hand soldering per IPC-A-610. For mixed-technology boards, we coordinate the full process sequence to minimise thermal excursions on heat-sensitive components.
| Min Component | 0201 (0.6×0.3 mm) |
| Min BGA Pitch | 0.4 mm |
| Max Board Size | 450 × 500 mm |
| Placement Accuracy | ±30 µm |
| Inspection | AOI + X-ray |
| IPC Standard | IPC-A-610 Class 2/3 |
Every build passes through six independent inspection stages — each with documented records you can reference against your IPC audit requirements.
All components and bare boards inspected on receipt. Date codes, quantity, and package marking verified before kitting. Counterfeit screening available on request.
3D solder paste volume, area, and offset measured at every deposit after printing. Boards failing SPI are re-printed — not sent to placement.
After placement, the first board of every job is manually verified by an engineer before the full run is approved. Component identity, polarity, and position confirmed against BOM.
Post-reflow AOI detects missing components, solder bridges, lifted leads, tombstoning, and polarity errors with photographic evidence logged per board.
BGA and other hidden-joint packages inspected by X-ray for voiding, cold joints, and bridging not visible to AOI. Sampling rate or 100% inspection per your spec.
IPC-A-610 visual workmanship check by a certified IPC-CIS. CoC, test records, and traveller documentation packaged with every shipment.
From simple AOI to full functional validation — we match test coverage to your product's risk profile and qualification requirements.
Bring your own parts or let us source everything. Either way, every component goes through IQC before it touches your board.
Most Philippine manufacturers juggle separate vendors for design, fabrication, and assembly. We combine all three under one roof, with engineers based in-country.
For layout design: schematic (PDF or native EDA file), BOM, and mechanical drawings. For fabrication only: Gerber RS-274X files, drill file (Excellon), and a readme with stackup and impedance requirements. For assembly: Gerbers, BOM with manufacturer part numbers, and centroid (pick-and-place) file. If you have an existing design but no Gerbers, we can extract them from your native files.
Yes. Our assembly line handles BGA down to 0.4 mm pitch and CSP packages. X-ray inspection is available for all hidden-joint verification. For HDI designs requiring laser-drilled microvias to fan out fine-pitch BGA, we coordinate with our fab partner for the appropriate any-layer HDI stackup.
We offer full turnkey (we source all components from authorised distributors — Avnet, Mouser, Digi-Key, or local PH distributors), partial kitting (you supply the long-lead or controlled components, we source the rest), and consignment assembly (you supply all components, we assemble). We do not purchase from grey-market or unverified brokers.
Yes. For automotive applications we support AEC-Q component selection guidance, IATF 16949-aligned supplier chain for fabrication, high-temperature laminates (Tg 170+), and extended IPC-A-610 Class 3 inspection criteria. We can generate PPAP documentation for your incoming quality records on request.
There is no minimum order quantity. We regularly run single-board prototypes for R&D teams and scale to production volumes of thousands of units for EMS customers. Pricing is naturally more economical at higher volumes, but we do not impose a minimum.
Send us your schematic, Gerbers, or just a napkin sketch — our engineers will review your design and come back with a quote and DFM feedback, usually within one business day.